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Full range of product solutions, from optical encoder chips to AI motion control sensor modules.

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Optical Switch Modules
Photo Interrupter DIP Type
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Optical Switch Modules
Photo IC Interrupter PCBA Module
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Optical Switch Modules
Photo IC Interrupter PCBA Module
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Distance Sensor Modules
Distance sensor (PD+IC integrated) PCB Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
Distance sensor (PD+IC integrated) PCB Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
Distance sensor SOP‑8 Discrete Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
Distance sensor SOP‑8 Discrete Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
​Distance sensor Module
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
​Distance sensor Module
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Integrated Robotic Joint Module
Integrated Robotic Joint Module

Comparison DimensionTraditional Motor/Joint ModuleIntegrated Smart Motor/Integrated Joint ModuleDesign PhilosophyModular design, distributed componentsHighly integrated, compact structurePrecisionRelatively low, single designHigh, dual-encoder designResponse SpeedSlower, high communication latencyFa

Intelligent Encoder with Integrated Sensing, Driving, Control, and Computing
Intelligent Encoder with Integrated Sensing, Driving, Control, and Computing

Industry-first integrated smart encoder with sensing,driving,control and computing,applicable to integrated smart motors and robotic joint modules.New Positioning: An integrated "sensing-driving-control-computing" systematic smart product, replacing traditional single-function sensors.Core

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