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Full range of product solutions, from optical encoder chips to AI motion control sensor modules.

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Optical Components
LTV/ LTF
Optical Components

Optical ComponentsProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsLTV/ LTFPN: LTV/LTV PackagePackaging Process: MoldingDimensions: TBDWide operating voltage: 2.7 ~ 3.6V3-in-1 chip: Photodiode + ICLTV: Analog voltage output upon light receptionLTF: Frequency output upon light rece

Optical Components
IR Emitter/ Receiver
Optical Components

Optical ComponentsProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsLTV/ LTFPN: LTV/LTV PackagePackaging Process: MoldingDimensions: TBDWide operating voltage: 2.7 ~ 3.6V3-in-1 chip: Photodiode + ICLTV: Analog voltage output upon light receptionLTF: Frequency output upon light rece

POF(DAI) (Fiber Optic Transmitter & Receiver)
Photolink Tx(Emitter)
POF(DAI) (Fiber Optic Transmitter & Receiver)

Optical ComponentsProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsLTV/ LTFPN: LTV/LTV PackagePackaging Process: MoldingDimensions: TBDWide operating voltage: 2.7 ~ 3.6V3-in-1 chip: Photodiode + ICLTV: Analog voltage output upon light receptionLTF: Frequency output upon light rece

POF(DAI) (Fiber Optic Transmitter & Receiver)
Photolink Rx(Receiver)
POF(DAI) (Fiber Optic Transmitter & Receiver)

Optical ComponentsProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsLTV/ LTFPN: LTV/LTV PackagePackaging Process: MoldingDimensions: TBDWide operating voltage: 2.7 ~ 3.6V3-in-1 chip: Photodiode + ICLTV: Analog voltage output upon light receptionLTF: Frequency output upon light rece

POF(DAI) (Fiber Optic Transmitter & Receiver)
Photolink Rx(Receiver)
POF(DAI) (Fiber Optic Transmitter & Receiver)

Optical ComponentsProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsLTV/ LTFPN: LTV/LTV PackagePackaging Process: MoldingDimensions: TBDWide operating voltage: 2.7 ~ 3.6V3-in-1 chip: Photodiode + ICLTV: Analog voltage output upon light receptionLTF: Frequency output upon light rece

Optical Encoder Modules
Encoder Standard Type Formed‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Encoder Modules
Encoder Standard Type Formed‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Encoder Modules
Encoder Standard Type Straight‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Encoder Modules
Encoder Standard Type Straight‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Encoder Modules
​Encoder Screw Mount Formed‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Encoder Modules
​Encoder Screw Mount Formed‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Encoder Modules
Encoder Screw Mount Straight‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Encoder Modules
Encoder Screw Mount Straight‑pin
Optical Encoder Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsEncoderStandard Type Formed‑pin1.Package: Transparent Epoxy Mold- IRED 850nm Point Light Source- PDIC (LPI)2.Holder Case3.Lens (Collimated Light)Wide operating voltage: 2.5V‑12V90/150/180/200/300/360 LPI(4 types of IC chips‑Bipol

Optical Switch Modules
Photo Interrupter SMD Type
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Optical Switch Modules
Photo Interrupter SMD Type
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Optical Switch Modules
Photo Interrupter DIP Type
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Optical Switch Modules
Photo Interrupter DIP Type
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Optical Switch Modules
Photo IC Interrupter PCBA Module
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Optical Switch Modules
Photo IC Interrupter PCBA Module
Optical Switch Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsPhoto InterrupterSMD Type1. Package:- Emitter: IRED 940nm- Receiver: PTR2. Holder Case3. Housing material: PC-G30%• GAP: 3.0mm• Fast response Time• Thin and small package• Pb Free• RoHS Compliant• LED• IRED• PDIC + CC

Distance Sensor Modules
Distance sensor (PD+IC integrated) PCB Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
Distance sensor (PD+IC integrated) PCB Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
Distance sensor SOP‑8 Discrete Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
Distance sensor SOP‑8 Discrete Package
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
​Distance sensor Module
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

Distance Sensor Modules
​Distance sensor Module
Distance Sensor Modules

ProductPicturePackage TypeDescriptionApplicationsApplicable IC chipsDistance sensor(PD+IC integrated)PCB Package1. Package: COB SMD Type2. Amp IC + PhotoDiode = One package3. Dimension: w3.2×d2.8 ×t2.48mm(TBD)4. Board Material: Hi_Tg FR5• Wide operating voltage: 3V~5V• LED modulation frequ

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